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SPTS Technologies is Supplier of Choice for Fan-Out Wafer Level Packaging Production

SPTS_250ESTnet Premier Members SPTS Technologies, an Orbotech company and supplier of advanced wafer processing solutions for the global semiconductor and related industries, has received orders totaling approximately $57 million in value for multiple Sigma fxP PVD systems from a global manufacturer of packaged die. 

The systems will deposit under bump metals and redistribution layers (RDL) for Fan-Out Wafer Level Packaging (FOWLP) production.  System deliveries and revenue recognition are expected to commence in the fourth quarter of 2015 and continue throughout the first half of 2016.

Orbotech’s fourth quarter and full year 2015 revenue guidance included the initial revenues expected to be recognized from these orders during this period.

The burgeoning market for thinner smart phones, tablets, wearable devices and Internet of Things (IoT) connected consumer goods has created a significant need for this cost-effective high density format.   There are numerous FOWLP platforms in or near production from many companies including eWLB (STATS ChipPAC, NANIUM and ASE), SLIM & SWIFT (Amkor), InFO (TSMC) and RCP (Freescale). A

As part of Orbotech, with its multiple touch points throughout diverse electronics manufacturing environments, SPTS plays a key role in FOWLP advanced packaging solutions with numerous customer installations.

“This groundbreaking multi-PVD system order, the first from any semiconductor manufacturing company for FOWLP, is a ‎milestone moment for advanced packaging,” said Mr. Kevin Crofton, President of SPTS and Corporate Vice President at Orbotech. “It marks the beginning of an industry-wide transition of FOWLP from a niche packaging technique for small devices such as RFID and power management ICs to mainstream architecture for high value chips.  We expect FOWLP to become the leading low cost, high density packaging format.”